The first batch of land development projects in Phase 1 of the Hong Kong-Shenzhen Innovation and Technology Park in the Hetao Hong Kong Park area received six bids at noon today, according to ETNet.
Hong Kong-Shenzhen Innovation and Technology Park Co. said this was the first development project in the park to invite market participation. It comprises two land packages covering four plots, with each package including one innovation and technology site. Bidders could also choose to submit bids for one talent housing plot.
The company said the six bids came from high-end technology industries and large integrated enterprises aligned with the park's development. It added that the initial tender response was encouraging and reflected industry confidence in Hong Kong's innovation and technology advantages and the park's prospects.
The tender uses a dual-envelope system, with technical proposals and price proposals weighted 70% and 30%, respectively. The company aims to complete the award process and announce the results within this year.
It also said on July 24 that it had launched tenders for another three innovation and technology plots and one talent housing plot, with the deadline set for noon on October 20 this year.