Core Scientific Plans $3.3 Billion Junk Bond Issuance for AI Infrastructure

Core Scientific Inc. is planning to raise $3.3 billion through a junk bond issuance, according to Bloomberg. According to BlockBeats, this move aligns with a trend among high-yield issuers leveraging debt markets to finance artificial intelligence infrastructure. A source with direct knowledge of the matter revealed that the company is developing six data center facilities. These facilities are fully contracted with CoreWeave Inc. under a 12-year agreement, expected to generate approximately $10 billion in revenue.