Bond Protocol, a bond market agreement, completed a $2.5 million seed round of financing led by Chapter One Ventures and IDEO CoLab Ventures, with participation from Alchemy Ventures and Hypersphere. On October 4, Bond Protocol also released a beta version. In July, the algorithmic stablecoin agreement OlympusDAO split the securitization market Olympus Pro and renamed it Bond Protocol, and the vote on the proposal was passed. Olympus will use Bond Protocol for bond protocol operations. Bond Protocol will have a license-free market, combinable bonds ( Tokenization), modular auction interface and other functions.